UV Curing Lamp - Zosika AKL-97PHC · Same-Grade Replacement for PHOENIX SHP97A
DC 210W · Includes UV band · Plug-and-play.
Key Specifications Comparison
| Item | Zorsika AKL-97PHC | PHOENIX SHP97A |
|---|---|---|
| Light Source Type | Short-arc metal halide lamp (includes UV band) | Short-arc metal halide lamp (includes UV band) |
| Rated Power | DC 210W | DC 210W |
| Average Lifetime | Approx. 2,000 hours | Approx. 2,000 hours |
| Spectral Characteristics | Includes UV band with visible-light output | Includes UV band |
| Compatible Main Unit | / | / |
| Main Use | Fixed-point UV adhesive curing, simple UV exposure | UV point-source curing, film exposure |
1. 210W UV Point Light Source — Same-Grade Replacement for the PHOENIX SHP97A
Continuing the UV point-source positioning of the SHP97A, it focuses on fixed-point UV adhesive curing and simple UV exposure stations, and can be used as a same-grade replacement lamp for this model.
2. Output Includes the UV Band — Suited to Photocuring Processes
The spectrum of the short-arc metal halide lamp includes the UV band, delivering fixed-point exposure energy to photosensitive materials such as UV adhesives, UV inks, and photoresists — suitable for small-area, high-precision local curing.
3. 2,000-Hour Nominal Lifetime — Fewer Lamp Changes
Compared with similar UV point light sources, the 2,000-hour nominal lifetime reduces the number of line stoppages for lamp replacement. Actual lifetime is strongly affected by the thermal conditions of the end equipment, operating hours, and start/stop frequency; 2,000 hours is a typical operating average, not a guaranteed value.
4. Supply and Cost Advantages of a Domestic Alternative
Compared with the imported original, stock is ample and lead time is controllable, with a per-lamp cost significantly lower than the OEM. It suits batch replacement across UV curing lines, laboratories, and lithography processes.
Mainstream Application Scenarios
- ▪ Fixed-point UV adhesive curing: precise UV curing of adhesives in optical communication components, micro motors, medical devices, and optical element assembly
- ▪ Semiconductor & precision electronics processes: UV exposure steps for wafer-level packaging, IC substrates, and FPC flexible boards
- ▪ Laboratory optics & simple UV exposure: photoresist exposure, UV curing experiments, and optical material modification research
- ▪ Film / printing plate exposure: UV exposure stations in conventional printing plate-making workflows (requires the appropriate mask and optical path system)